BGA Component Rework Inspection

 BGA Component Rework Inspection

This document has been prepared by Circuit Technology Center, Inc.. The purpose is to ensure repeatable, high quality rework of BGA components, and to assure conformity to the highest industry standards and specifications.

NOTEThis document covers procedure and guidelines specific to BGA component rework conducted by the staff at Circuit Technology Center, Inc. Organizations using this information may need to make modifications, or other changes, to accomodate their own particular needs.

NOTEThis document is under development. Refer to available industry sources including recommendations from IPC while this document is being developed.