การดูแลทำความสะอาดกล้องถ่ายภาพ

ส่วนที่จะให้แสดง ส่วนที่เหลือ...[Readmore]

เทคนิคการถ่ายภาพระยะชัดลึก Dept of Field

ส่วนที่จะให้แสดง ส่วนที่เหลือ...[Readmore]

วิธีการเก็บรักษากล้อง

วิธีการเก็บรักษากล...[Readmore]

SUPER CCD

SUPER CCD ของ FUJIเป็น CCD ที่ทาง FUJI คิดค้นออกแบบโครงสร้างใหม่ เพื่อต้องการพัฒนาให้ได้คุณภาพที่ดีขึ้นในหลายๆด้านทั้ง ความไวแสงที่สูงขึ้น, dynamic range ที่กว้างขึ้น, noise ที่ต่ำลงและความละเอียดที่สูงขึ้น โดยเริ่มจาก ในปี 1999 ทางฟูจิได้เปิดตัว 1st generation SUPER CCD สู่ตลาด โดยรูปแบบของ super CCD จะเปลี่ยนจาก CCD ปกติที่ใช้ photo diodes เซลรับแสงแบบสี่เหลี่ยม อยู่บนแต่ละพิกเซล ซึ่งวางเรียงต่อๆกันอยู่บน CCD กลายเป็น SUPER CCD แบบรังผึ้งแปดเหลี่ยม...[Readmore]

Component Removal, Surface Mount Gull Wing Components, Hot Gas/Air Method

Component Removal, Surface Mount Gull Wing Components, Hot Gas/Air Method    TOOLS & MATERIALS Caliper Cleaner Flux, Liquid Hot Air Removal Tool with Tips Microscope Oven Positioning Table Rework Stand Vacuum Pen Wipes PREPARATION Figure 1: Nozzle at left heats the leads and pads. Nozzle at right heats component, leads and pads. This method uses hot air nozzles that do not touch the component. Gas or air is heated and forced...[Readmore]

Component Removal, Surface Mount Gull Wing Components, Conduction Method

Component Removal, Surface Mount Gull Wing Components, Conduction Method Surface Mount Gull Wing Component TOOLS & MATERIALS Caliper Cleaner Conduction Removal Tool with Tips Flux, Liquid Microscope Oven Positioning Table Rework Stand Soldering Iron with Tips Wipes PREPARATION Figure 1: Conduction tip shown with solder added to enhance removal operation. This method uses tips that are designed to fit over the top of surface mount...[Readmore]

Component Removal, Surface Mount J Lead Components, Hot Gas/Air Method

Component Removal, Surface Mount J Lead Components, Hot Gas/Air Method TOOLS & MATERIALS Caliper Cleaner Flux, Liquid Hot Air Removal Tool with Tips Microscope Oven Positioning Table Rework Stand Vacuum Pen Wipes PREPARATION Figure 1: Nozzle at left heats the leads and pads. Nozzle at right heats component, leads and pads. This method uses hot air nozzles that do not touch the component. Gas or air is heated and forced through a specially...[Readmore]

Component Removal, Surface Mount Chip Components, Hot Tweezer Method

Component Removal, Surface Mount Chip Components, Hot Tweezer Method NOTEThe goal when removing any component is to remove the component as quickly as possible. CAUTION - Glued Components A small dot of epoxy is often used to hold chip components in position during wave soldering processing. Typically these components will be located on the bottom side of a circuit board that has through hole components located on the other side. Whenever you...[Readmore]

Component Removal, Surface Mount J Lead Components, Conduction Method

Component Removal, Surface Mount J Lead Components, Conduction Method TOOLS & MATERIALS Caliper Cleaner Conduction Removal Tool with Tips Flux, Liquid Microscope Oven Positioning Table Rework Stand Soldering Iron with Tips Wipes PREPARATION Figure 1: Conduction tip shown with solder added to enhance removal operation. This method uses tips that are designed to fit over the top of surface mount components, and to reflow all the solder...[Readmore]

Component Removal, Surface Mount Chip Components, Forked Tip Method

Component Removal, Surface Mount Chip Components, Forked Tip Method NOTEThe goal when removing any component is to remove the component as quickly as possible. CAUTION - Glued Components A small dot of epoxy is often used to hold chip components in position during wave soldering processing. Typically these components will be located on the bottom side of a circuit board that has through hole components located on the other side. Whenever you...[Readmore]

Component Removal, Through Hole Components, Solder Fountain Method

Component Removal, Through Hole Components, Solder Fountain Met...[Readmore]

Component Removal, Through Hole Components, Vacuum Method

Component Removal, Through Hole Components, Vacuum Method TOOLS & MATERIALSCleaner Flux Microscope Solder Solder Removal Tool, Vacuum Type with Tips Soldering Iron with Tips Wipes PROCEDURE - Straight Leads, Standard Method Figure 1: When the solder melts, activate the vacuum to remove the solder while oscillating the tip. Inspect the size of the solder joints on the component to be removed. If the size of the solder joint fillets are...[Readmore]

BGA Component Reballing, Fixture Method

BGA Component Reballing, Fixture Met...[Readmore]

BGA Component Rework

BGA Component Rework CAUTION - Operator Safety A thorough review of the equipment manual and comprehensive training are mandatory. Daily maintenance is essential. Consult the equipment manual for more information. CAUTION - Component Sensitivity This method may subject the component to extreme temperatures. Evaluate the component's tolerance to heat prior to using this method. CAUTION - Circuit Board Sensitivity PC Boards are made from a great...[Readmore]

BGA Component Rework Profile Development, Smart Track Method

BGA Component Rework Profile Development, Smart Track Method TOOLS & MATERIALS Aluminum Foil BGA Rework Nozzles BGA Rework System (Air-Vac) Cleaner Cleaning Wipes Microscope Oven Profile Development Circuit Board Assembly Profile Development BGA Components Tape, Kapton Tape, High Temperature Masking Thermal Adhesive (J-B Weld) Thermometer, Digital CAUTION - Operator Safety A thorough review of the equipment manual and comprehensive training...[Readmore]

BGA Component Rework Profile Development, Standard Method

BGA Component Rework Profile Development, Standard Method TOOLS & MATERIALS Ball Mills BGA Specific nozzle Cleaner Cleaning Wipes Flux, Liquid Microscope Hot Air Rework Station Hand held Digital Thermometer Oven Precision Drill Press Scrap development Assembly Scrap BGA Components Tape, Kapton Temperature recorder, and Analysis Software Thermal Adhesive CAUTION - Operator Safety A thorough review of the equipment manual and comprehensive training...[Readmore]